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  d a t a sh eet preliminary speci?cation file under integrated circuits, ic02 december 1991 integrated circuits TDA9160 pal/ntsc/secam decoder/sync processor
december 1991 2 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 features multistandard pal, ntsc and secam i 2 c-bus controlled i 2 c-bus addresses can be selected by hardware alignment free few external components designed for use with baseband delay lines integrated video filters horizontal and vertical drive output east-west correction drive output two cvbs inputs s-vhs input vertical divider system h a synchronization pulse two level sandcastle pulse general description the TDA9160 is an i 2 c-bus controlled, alignment-free pal/ntsc/secam decoder/processor. the device contains horizontal and vertical drive outputs and an east-west correction drive circuit. the TDA9160 has been designed for use with baseband chrominance delay lines and dc-coupled vertical and east-west output circuits. the device has three inputs, two for cvbs and one for s-vhs. the main signal is available at the luminance and colour difference outputs and, also, at the txt output (unprocessed). the signal at the pip output can be selected independently from the main signal. the circuit provides a drive pulse for the horizontal output stage, a differential sawtooth current for the vertical output stage and an east-west drive current for the ew output stage. these signals can be used to provide geometry correction of the picture. a two level sandcastle pulse and an h a pulse are made available for synchronization purposes .the i 2 c-bus address of the TDA9160 can be programmed by hardware. fig.1 block diagram.
december 1991 3 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 quick reference data ordering information note 1. sot232-1; 1996 december 2. symbol parameter conditions min. typ. max. unit v cc positive supply voltage 7.2 8.0 8.8 v i cc supply current - 50 - ma v 24,26(p-p) cvbs input voltage (peak-to-peak value) - 1.0 - v v 23(p-p) s-vhs luminance input voltage (peak-to-peak value) - 1.0 - v v 22(p-p) s-vhs chrominance burst input voltage (peak-to-peak value) - 0.3 - v v 1(p-p) luminance output voltage (peak-to-peak value) - 0.45 - v v 25(p-p) teletext output voltage (peak-to-peak value) - 1.0 - v v 2(p-p) chrominance output voltage - (r-y) (peak-to-peak value) pal/ntsc - 525 - mv v 2(p-p) chrominance output voltage - (r-y) (peak-to-peak value) secam - 1.05 - v v 3(p-p) chrominance output voltage - (b-y) (peak-to-peak value) pal/ntsc - 665 - mv v 3(p-p) chrominance output voltage - (b-y) (peak-to-peak value) secam - 1.33 - v v 10 h a output voltage - 5.0 - v i 15,16(p-p) vertical drive output current (peak-to-peak value) - 1 - ma i 18 horizontal drive output current -- 10 ma i 17 ew drive output current -- 0.9 ma v 6 sandcastle clamping voltage level - 4.5 - v v 6 sandcastle blanking voltage level - 2.5 - v extended type number package pins pin position material code TDA9160 32 sdil plastic sot232 (1)
december 1991 4 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 fig.2 pin configuration. pinning symbol pin description y 1 luminance output - (r-y) 2 chrominance output - (b-y) 3 chrominance output scl 4 serial clock input sda 5 serial data input/output sc 6 sandcastle output v cc 7 positive supply input dec 8 positive supply decoupling dgnd 9 digital ground h a 10 horizontal acquisition synchronization pulse v saw 11 vertical sawtooth i ref 12 input current reference agnd1 13 analog ground eht/prot 14 eht tracking and over-voltage protection vout a 15 vertical drive output a vout b 16 vertical drive output b ewout 17 east-west drive output hout 18 horizontal drive output hfb 19 horizontal ?yback input pip 20 picture-in-picture output hpll 21 horizontal pll ?lter svhsc 22 s-vhs chrominance input svhsy 23 s-vhs luminance input cvbs2 24 cvbs2 input txt 25 teletext output cvbs1 26 cvbs1 input agnd2 27 analog ground filt ref 28 ?lter reference decoupling pll 29 colour pll ?lter xtal 30 reference crystal input xtal2 31 second crystal input sec ref 32 secam reference decoupling
december 1991 5 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 functional description the TDA9160 is an i 2 c-bus controlled, alignment free pal/ntsc/secam colour decoder/sync processor/deflection controller which has been designed for use with baseband chrominance delay lines. in the standard operating mode the i 2 c-bus address is 8a . if the txt output is connected to the positive rail the address will change to 8e the standards which the TDA9160 can decode are dependent on the choice of external crystals. if a 4.4 mhz and a 3.6 mhz crystal are used then secam, pal 4.4/3.6 and ntsc 4.4/3.6 can be decoded. if two 3.6 mhz crystals are used then only pal 3.6 and ntsc 3.6 can be decoded. which 3.6 mhz standards can be decoded is dependent on the exact frequencies of the crystal. in an application where not all standards are required only one crystal is sufficient (in this instance the crystal must be connected to the reference crystal input (pin 30)). if a 4.4 mhz crystal is used it must always be connected to pin 30. both crystals are used to provide a reference for the filters and the horizontal pll, however, only the reference crystal is used to provide a reference for the secam demodulator. to enable the calibrating circuits to be adjusted exactly two bits from the i 2 c-bus address are used to indicate which crystals are connected to the ic. the standard identification circuit is a digital circuit without external components; the search loop is illustrated in fig.3. the decoder (via the i 2 c-bus) can be forced to decode either secam or pal/ntsc (but not pal or ntsc). crystal selection can also be forced. information, concerning which standard and which crystal have been selected and whether the colour killer is on or off is provided by the read out. using the forced-mode does not affect the search loop, it does, however, prevent the decoder from reaching or staying in an unwanted state. the identification circuit skips impossible standards (e.g. secam when no 4.4 mhz crystal is fitted) and illegal standards (e.g. forced mode). to reduce the risk of wrong identification pal has priority over secam (only line identification is used for secam). the TDA9160 has two cvbs inputs and one s-vhs input which can be selected via the i 2 c-bus. the input selector can also be switched to enable cvbs2 to be processed, providing that there is no s-vhs signal present at the input. if the input selector is set to cvbs2 it will switch to s-vhs if an s-vhs sync pulse is detected at the luminance input. the s-vhs detector output can be read via the i 2 c-bus. if the voltage at either the s-vhs luminance or the chrominance input (pins 22 and 23) exceeds +5.5 v the ic will revert to test mode. the TDA9160 also provides outputs for picture-in-picture and teletext (pip pin 20 and txt pin 25). the decoder input signal can be switched directly to the txt output. the pip output signal can be selected independently from the txt output. if s-vhs is selected at the txt output only the luminance signal will be present; if s-vhs is selected at the pip output then the luminance and chrominance signals will be added. all filters, including the luminance delay line, are an integral part of the ic. the filters are gyrator-capacitor type filters. the resonant frequency of the filters is controlled by a circuit that uses the active crystal to tune the secam cloche filter during the vertical flyback time. the remaining filters and the delay line are matched to this filter. the filters can be switched to either 4.43 mhz, 4.28 mhz or 3.58 mhz irrespective of the frequency of the active crystal. the switching is controlled by the identification circuit. the s-vhs luminance signal does not pass through the notch filter to preserve bandwidth. the luminance delay line delivers the y signal to the output 40 ns after the - (r-y) and - (b-y) signals. this compensates for the delay of the external chrominance delay lines. the pal/ntsc demodulator employs an oscillator that can operate with either crystal (3.6 or 4.4 mhz). if the i 2 c-bus indicates that only one crystal is connected it will always connect to the crystal at the reference input (pin 30). the hue signal, which is adjustable via the i 2 c-bus, is gated during the burst for ntsc signals. the secam demodulator is an auto-calibrating pll demodulator which has two references. the reference crystal, to force the pll to the desired free-running frequency and the bandgap reference, to obtain the correct absolute value of the output signal. the vco of the pll is calibrated during each vertical flyback period, when the reference crystal is active. when the second crystal is active the vco is not calibrated. during this time the frequency of the vco is kept constant by applying a constant voltage to its control input. if the reference crystal is not 4.4 mhz the decoder will not produce the correct secam signals. the main part of the sync circuit is a 432 f h (6.75 mhz) oscillator the frequency of which is divided by 432
december 1991 6 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 to lock the phase 1 loop to the incoming signal. the time constant of the loop can be forced by the i 2 c-bus (fast or slow). if required the ic can select the time constant, depending on the noise content of the input signal and whether the loop is phase locked or not (medium or slow). the free-running frequency of the oscillator is determined by a digital control circuit that is locked to the active crystal. when a power-on-reset pulse is detected the frequency of the oscillator is switched to a frequency greater than 6.75 mhz to protect the horizontal output transistor. the oscillator frequency is reset to 6.75 mhz when the crystal indication bits have been loaded into the ic. to ensure that this procedure does not fail it is absolutely necessary to send subaddress 00 before subaddress 01. subaddress 00 contains the crystal indication bits, when subaddress 01 is received the line oscillator calibration will be initiated. the calibration is terminated when the oscillator frequency reaches 6.75 mhz. the oscillator is again calibrated when an out-of-lock condition with the input signal is realised by the coincidence detector. again the calibration will be terminated when the oscillator frequency reaches 6.75 mhz. the phase 1 loop can be opened using the i 2 c-bus. this is to facilitate on screen display (osd) information. if there is no input signal or a very noisy input signal the phase 1 loop can be opened to provide a stable line frequency and thus a stable picture. the sync part provides an h a pulse that is coupled to the processed cvbs signal. the horizontal drive signal can be switched off via the i 2 c-bus (standby mode). the horizontal drive is also switched off when the over-voltage protection circuit trips or when a por is detected. should either of these two conditions occur the ic will return to the normal operating mode when the appropriate command is received via the i 2 c-bus. the duty cycle of the horizontal drive signal is increased from 2%, at start-up, to a constant value of 55% in approximately 300 lines. the two-level sandcastle pulse provides a combined horizontal and vertical blanking signal and a clamping pulse coupled to the display section of the tv. the vertical sawtooth generator drives the geometry processing circuits which provide control for the horizontal shift, ew width, ew parabola/width ratio, ew corner/parabola ratio, trapezium correction, vertical slope, vertical shift, vertical amplitude and the s-correction. all of these control functions can be set via the i 2 c-bus. the geometry processor has a differential current output for the vertical drive signal and a single-ended output for the ew drive. both the vertical drive and the ew drive outputs can be modulated for eht compensation. the eht compensation pin (pin 14) can also be used for over-voltage protection. de-interlace of the vertical output can be set via the i 2 c-bus. the vertical divider system has a fully integrated vertical sync separator. the divider can accommodate both 50 and 60 hz systems; it can either locate the field frequency automatically or it can be forced to the desired system via the i 2 c-bus. a block diagram of the vertical divider system is illustrated in fig.4. the divider system operates at 432 times the horizontal line frequency. the line counter receives enable pulses at twice the line frequency, thereby counting two lines per pulse. a state diagram of the controller is illustrated in fig.5. because it is symmetrical only the right hand part will be described. depending on the previously found field frequency, the controller will be in one of the 'count' states. when the line counter has counted 488 pulses (i.e. 244 lines of the video input signal) the controller will move to the next state depending on the output of the norm counter. this can be either norm, near-norm or no-norm depending on the position of the vertical sync pulse in the previous fields. when the counter is in the norm state it generates the vertical sync pulse (vsp) automatically and then, when the line counter is at lc = 626, moves to the wait state. in this condition it waits for the next pulse of the double line frequency signal and then moves to the count state of the current field frequency. when the controller returns to the count state the line counter will be reset half a line after the start of the vertical sync pulse of the video input signal. when the controller is in the near-norm state it will move to the count state if it detects the vertical sync pulse within the near-norm window (i.e. 622 < lc < 628). if no vertical sync pulse is detected, the controller will move back to the count state when the line counter reaches lc = 628. the line counter will then be reset. when the controller is in the no-norm state it will move to the count state when it detects a vertical sync pulse and reset the line counter. if a sync pulse is not detected before lc = 722 (if the phase loop is locked in forced mode) it will move to the count state and reset the line counter. if the phase loop is not locked the controller will move back to the count state when lc = 628. the forced mode option keeps the controller in either the left-hand side (60 hz) or the
december 1991 7 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 right-hand side (50 hz) of the state diagram. figure 6 illustrates the state diagram of the 'norm' counter which is an up/down counter that counts up if it finds a vertical sync pulse within the selected window. in the near-norm and norm states the first correct vertical sync pulse after one or more incorrect vertical sync pulses is processed as an incorrect pulse. this procedure prevents the system from staying in the near-norm or norm state if the vertical sync pulse is correct in the first field and incorrect in the second field. if no vertical sync pulse is found in the selected window this will always result in a down pulse for the 'norm' counter. figure 7 illustrates the timing of the display sandcastle (dsc) and the reset pulse of the vertical sawtooth with respect to the input signal i 2 c-bus protocol if the txt output is connected to the positive supply the address will change from 8a to 8e. valid subaddresses = 00 to 0f auto-increment mode available for subaddresses. subaddress 00 must always be sent before subaddress 01 in order to protect the horizontal output transistor. table 1 slave address (8a) table 2 inputs table 3 outputs a6 a5 a4 a3 a2 a1 a0 r/ w 10001x1x subaddress msb lsb 00 ina inb inc ind foa fob xa xb 01 forf fors dl stb poc fm saf frqf 02 -- hu5 hu4 hu3 hu2 hu1 hu0 03 -- hs5 hs4 hs3 hs2 hs1 hs0 04 -- ew5 ew4 ew3 ew2 ew1 ew0 05 -- pw5 pw4 pw3 pw2 pw1 pw0 06 -- cp5 cp4 cp3 cp2 cp1 cp0 07 -- tc5 tc4 tc3 tc2 tc1 tc0 08 -- vs5 cs4 vs3 vs2 vs1 vs0 09 -- va5va4va3va2va1va0 0a -- sc5 sc4 sc3 sc2 sc1 sc0 0b sbl - vsh5 vsh4 vsh3 vsh2 vsh1 vsh0 address por fsi sts sl prot sak sbk frq
december 1991 8 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 fig.3 search loop of the identification circuit. fig.4 block diagram of the vertical divider system.
december 1991 9 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 fig.5 state diagram of the vertical divider system. fig.6 state diagram of the norm counter.
december 1991 10 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 fig.7 field timing diagram.
december 1991 11 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 input signals table 4 source select 1 ina inb decoder and txt 0 0 cvbs1 0 1 cvbs2 1 0 s-vhs 1 1 s-vhs (cvbs2) table 5 source select 2 inc ind decoder and txt 0 0 cvbs1 0 1 cvbs2 1 0 s-vhs 1 1 s-vhs (cvbs2) table 6 phase time constant foa fob mode 0 0 auto 0 1 slow 1 - fast table 7 xtal indication xa xb crystal 0 0 2 x 3.6 mhz 0 1 1 x 3.6 mhz 1 0 1 x 4.4 mhz 1 1 3.6 and 4.4 mhz table 8 forced ?eld frequency forf fors field frequency 0 0 auto 0 1 60 hz 1 0 50 hz 1 1 auto table 9 interlace dl condition 0 interlace 1 de-interlace table 10 standby stb condition 0 standby 1 normal mode table 11 phase loop control poc condition 0 phi one loop closed 1 phi one loop open table 12 forced standard note to table 12 1. if xa and xb indicate that only one crystal is connected to the ic and fm and frqf force it to use the second crystal the colour will be switched off. add logic condition fm 0 auto search 1 forced mode saf 0 pal/ntsc 1 secam frqf 0 second crystal 1 reference crystal table 13 service blanking sbl condition 0 service blanking off 1 service blanking on
december 1991 12 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 table 14 other input signals table 15 standard read-out function address digital number hue hu5 to hu0 000000 = - 45 111111 = +45 horizontal shift hs5 to hs0 000000 = - 2.2 m s 111111 = +2.2 m s ew width ew5 to ew0 000000 = 80% 111111 = 100% ew parabola/width pw5 to pw0 000000 = 0% 111111 = 24% ew corner/parabola cp5 to cp0 000000 = 0% 111111 = - 44% ew trapezium tc5 to tc0 000000 = - 4% 111111 = + 4% vertical slope vs5 to vs0 000000 = - 14% 111111 = + 14% vertical amplitude va5 to va0 000000 = - 80% 111111 = + 120% s correction sc5 to sc0 000000 = 0% 111111 = 20% vertical shift vsh5 to vsh0 000000 = - 4% 111111 = + 4% sak sbk frq standard 0 0 0 pal, second crystal 0 0 1 pal, reference crystal 0 1 0 ntsc, second crystal 0 1 1 ntsc, reference crystal 1 0 0 not used 1 0 1 secam, reference crystal 1 1 0 colour off 1 1 1 colour off
december 1991 13 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 input signals table 16 power-on-reset table 17 field frequency indication table 18 s-vhs status table 19 phase lock indication table 20 over-voltage protection por condition 0 normal mode 1 power-down mode fsi condition 0 50 hz 1 60 hz sts condition 0 no signal at input 1 signal at input sl condition 0 not locked 1 locked prot condition 0 no over-voltage detected 1 over-voltage detected
december 1991 14 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 limiting values in accordance with the absolute maximum system (iec134) thermal resistance characteristics v cc = 8 v; t amb = 25 c; unless otherwise speci?ed. symbol parameter conditions min. max. unit v cc positive supply voltage - 8.8 v i cc supply current - 70 ma p tot total power dissipation -- w t stg storage temperature range - 55 + 150 c t amb operating ambient temperature range - 10 + 65 c symbol parameter thermal resistance r th j-a from junction to ambient in free air t.b.f. symbol parameter conditions min. typ. max. unit supply v cc positive supply voltage 7.2 8.0 8.8 v i cc supply current - 50 - ma p tot total power dissipation - 400 - mw input switch cvbs1 and cvbs2 inputs ( pins 26 and 24) v 26,24(p-p) input voltage (peak-to-peak value) - 1.0 1.43 v z i input impedance 60 -- k w s-vhs y input ( pin 23) v 23(p-p) input voltage (peak-to-peak value) - 1.0 1.43 v z i input impedance 60 -- k w s-vhs chrominance input v 22(p-p) input voltage (peak-to-peak value) burst - 0.3 1.43 v z i input impedance 60 -- k w l uminance output ( pin 1) v 1(p-p) output voltage (peak-to-peak value) - 450 - mv z o output impedance -- 500 w v o top sync level - 2.1 - v s/n signal-to-noise ratio - tbf - db supp suppression of unselected inputs 50 -- db
december 1991 15 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 txt and pip outputs ( pins 25 and 20) v 20,25(p-p) output voltage (peak-to-peak value) - 1.0 - v z o output impedance -- 500 w v o top sync level txt output - 1.8 - v pip output - 2.8 - v supp suppression of unselected inputs f = 0 to 5 mhz; pip output 50 -- db supp suppression of unselected inputs f = 0 to 5 mhz; txt output 35 -- db bias generator v 8 digital supply voltage - 5.0 - v v 12 dc voltage - 3.9 - v subcarrier regeneration v acc(p-p) burst amplitude within acc range (peak-to-peak value) 25 - 500 mv cr catching range note 1 500 -- hz j phase shift for 400 hz deviation -- 5 deg tc temperature coef?cient of oscillator - tbf - hz/k z i input impedance reference crystal input - 1.0 - k w second crystal input - 1.5 - k w v dep supply voltage dependency - tbf - v demodulators d 2/ d 3 change of - (r-y) and - (b-y) signals over the acc range -- 1db ratio of - (r-y) and - (b-y) signals - 1.27 - tc temperature coef?cient of - (r-y) and - (b-y) amplitude - tbf - hz/k spread of - (r-y) and - (b-y) ratio between standards - 1 -+ 1db v 2 output level of - (r-y) during blanking - 2.0 - v v 3 output level of - (b-y) during blanking - 2.0 - v b bandwidth at - 3 db - 1 - mhz z o output impedance -- 500 w v dep supply voltage dependency - tbf - v symbol parameter conditions min. typ. max. unit
december 1991 16 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 pal/ntsc demodulator v 2(p-p) - (r-y) output voltage (peak-to-peak value) standard colour bar - 525 - mv v 3(p-p) - (b-y) output voltage (peak-to-peak value) standard colour bar - 665 - mv a crosstalk between - (r-y) and - (b-y) - tbf - db v 2,3(p-p) 8.8 mhz residue (peak-to-peak value) both outputs -- 15 mv v 2,3(p-p) 7.2 mhz residue (peak-to-peak value) both outputs -- 20 mv s/n signal-to-noise ratio 46 -- db pal demodulator v r(p-p) h/2 ripple (peak-to-peak value) -- 50 mv s/n signal-to-noise ratio 46 -- db ntsc demodulator j hue phase shift - 45 -+ 45 deg secam demodulator v 2(p-p) - (r-y) output voltage (peak-to-peak value) standard colour bar - 1.05 - mv v 3(p-p) - (b-y) output voltage (peak-to-peak value) standard colour bar - 1.33 - mv f os black level offset -- 7 khz s/n signal-to-noise ratio - 43 - db v res(p-p) 7.8 to 9.4 mhz residue (peak-to-peak value) -- 30 mv f pole pole frequency of deemphasis 77 85 93 khz ratio of pole and zero frequency - 3 - v cal calibration voltage 3.0 4.0 5.0 v nl non linearity -- 3% filters v tune tuning voltage 1.5 3.0 6.0 v luminance delay t d delay time pal/ntsc/bw - 430 - ns t d delay time secam - 480 - ns luminance trap f o notch frequency f sc = 3.6 mhz 3.53 3.58 3.63 mhz f sc = 4.4 mhz 4.37 4.43 4.49 mhz secam 4.23 4.29 4.35 mhz s-vhs/bw; not active symbol parameter conditions min. typ. max. unit
december 1991 17 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 b bandwidth at - 3 db f sc = 3.6 mhz - 2.8 - mhz f sc = 4.4 mhz - 3.4 - mhz secam - 3.3 - mhz supp subcarrier suppression 26 -- db c hrominance bandpass f res resonant frequency f sc = 3.6 mhz - 3.58 - mhz f sc = 4.4 mhz - 4.43 - mhz b bandwidth at - 3 db f sc = 3.6 mhz - 1.6 - mhz f sc = 4.4 mhz - 2 - mhz cloche ?lter f res resonant frequency secam 4.26 4.29 4.31 mhz b bandwidth at - 3 db; secam 241 268 295 khz sync input v 22 sync pulse amplitude cvbs 1/2; s-vhs input 50 300 600 mv slicing level - 50 - % t d delay of sync pulse due to internal ?lter 0.2 0.3 0.4 m s s/n noise detector threshold level - 20 - db h hysteresis - 3 - db t d delay between video signal and internally separated vertical sync pulse 12 18.5 27 m s horizontal section h a output ( pin 10) v oh output voltage high 2.4 5.0 5.5 v v ol output voltage low - 0.3 0.6 v i sink sink current 2 -- ma i source source current 2 -- ma t w pulse width 32 clock cycles - 4.7 -m s t d delay between middle of horizontal sync pulse and middle of h a note 2 0.3 0.45 0.6 m s f irst loop d f frequency deviation when not locked -- 1.5 % svrr supply voltage ripple rejection - tbf - v tc temperature coef?cient - tbf - hz/ c f cr catching range 625 -- hz f hr holding range -- 1400 hz f static phase shift -- 0.1 m s/khz symbol parameter conditions min. typ. max. unit
december 1991 18 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 s econd loop j control sensitivity 300 --m s/ m s t cr control range of the positive going edge of horizontal drive to ?yback hs = 00; note 4 13.5 --m s t d delay between second loop reference and mid-sync of processed video - 3 -m s h orizontal shift sr horizontal shift range 63 steps - 2.2 - +2.2 m s h orizontal drive output ( pin 18) r 18 output resistance on-state -- 50 w i 18 output current -- 10 ma duty cycle of output current - 55 - % h orizontal flyback input ( pin 19) v hb switching level for horizontal blanking - 0.3 - v v j 2 switching level for phase two loop - 3.8 - v v 19 maximum input voltage -- v cc v z i input impedance 10 -- m w soft start cr duty cycle control range 2 - 55 % soft start time 200 300 500 lines vertical section (note 3 ) v ertical oscillator f fr free running frequency divider ratio 628 - 50 - hz f lr frequency locking range 43 - 64 hz lr divider locking range 488 625 722 v ertical sawtooth ( pin 11) v 11(p-p) voltage amplitude level (peak-to-peak value) vs = 1f; c = 100 nf; r = 39 k w - 3.5 - v i dis discharge current - 1 - ma i charge charge current set by external resistor f = 50 hz; vs = 1f - 19 -m a cr vertical slope control range 63 steps - 14 -+ 14 % symbol parameter conditions min. typ. max. unit
december 1991 19 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 v ertical drive outputs ( pins 15 and 16) i diff(p-p) differential output current (peak-to-peak value) va = 1f - 1 - ma i 15,16 common mode current - 400 -m a v o output voltage range 0 - 4.0 v eht tracking and over - voltage protection ( pin 14) tr tracking range 1.2 - 2.8 v smr scan modulation range - 6 -+ 6% a sensitivity - 7.5 - %/v v 14 over-voltage protection detection level - 3.9 - v d e - interlace ?rst ?eld delay - 0.5h - sandcastle (pin 6) v 6 zero level 0 0.5 1.0 v i sink sink current 0.5 -- ma h orizontal and vertical blanking v bl blanking voltage level 2.0 2.5 3.0 v i source source current 0.5 -- ma i ext external current required to force the output to the blanking level 1 - 3ma c lamping pulse v clamp clamping voltage level 4.0 4.5 5.0 v i source source current 0.5 -- ma t w pulse width pal (17 llc pulses) - 2.5 -m s secam (24 llc pulses) - 3.6 -m s t d delay between mid sync of input and start of clamping pulse 3.6 3.7 3.8 m s geometry processing (note 3 ) ew width cr control range 63 steps 100 - 80 % i eq equivalent ew output current 0 - 400 m a v o ew output voltage range 1.0 - 8.0 v i o ew output current range 0 - 900 m a symbol parameter conditions min. typ. max. unit
december 1991 20 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 notes to the characteristics 1. all oscillator specifications are measured with the philips crystal series 4322 143/144. the spurious response of the reference crystal must be less than - 7 db with respect to the fundamental frequency for a damping resistance of 1k w. the spurious response of the second crystal must be less than - 7 db with respect to the fundamental frequency for a damping resistance of 1.5 k w . 2. this delay is caused by the low pass filter at the sync separator input. 3. all values are valid for a reference current of 100 m a (r c = 39 k w ). 4. valid for flyback pulse width of 12 m s at the switching level of the phase 2 loop. ew parabola / width cr control range 63 steps 0 - 24 % i eq equivalent ew output current ew = 3f 0 - 480 m a ew corner / parabola cr control range 63 steps - 44 - 0% i eq equivalent ew output current ew = 3f; pw = 3f - 210 - 0 m a ew trapezium cr control range 63 steps - 4 -+ 4% i eq equivalent ew output current - 80 -+ 80 m a ew eht tracking tr tracking range 1.2 - 2.8 v smr scan modulation range - 6 -+ 6% i eq equivalent output current + 120 -- 120 m a j sensitivity -- 7.5 - %/v v ertical amplitude cr control range 63 steps; sc = 00 80 - 120 % 63 steps; sc = 3f 86 - 112 % i eq equivalent differential vertical drive output current sc = 00 800 - 1200 m a v ertical shift cr control range 63 steps - 4 -+ 4% i eq equivalent differential vertical drive output current - 40 -+ 40 m a s correction cr control range 63 steps 0 - 20 % symbol parameter conditions min. typ. max. unit
december 1991 21 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 quality specification quality level according to urv 4-2-59/601. test and application information ew output stage in order to obtain the correct tracking of the vertical and horizontal eht correction, the ew output stage should be configured as illustrated in figure 8. note to fig.8 resistor r ew determines the gain of the ew output stage. resistor r c sets the reference current for both the vertical sawtooth generator and the geometry processor. the preferred value of r c = 39 k w results in a reference current of 100 m a (v ref = 3.9 v). the value of r ew is given in the following equation: example: if v ref = 3.9 k w , r c = 39 k w and v scan = 120 v then r ew = 68 k w symbol parameter range a range b unit esd protection circuit speci?cation (note1) 2000 500 v 100 200 pf 1500 0 w fig.8 configuration of the ew output stage. r ew r c v scan 18 v ref ) ( -------------------------------- =
december 1991 22 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 control ranges of geometry control parameters typical case curves (r c = 39 k w ; c saw = 100 nf) fig.9 control range of vertical amplitude. va = 0, 31 and 63; vsh = 31; sc = 0 fig.10 control range of vertical slope. va = 31; vs = 0, 31 and 63; vsh = 31; sc = 0 fig.11 control range of vertical shift. va = 31; vsh = 0, 31 and 63; sc = 0 fig.12 control range of s correction. sc = 0, 31 and 63; va = 31; vsh = 31. the picture height does not change with the setting of s correction for nominal setting of vertical amplitude (va = 31).
december 1991 23 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 fig.13 control range of ew width. ew = 0, 31 and 63; pw = 31; cp = 31 fig.14 control range of ew parabola/width ratio. ew = 0, 31 and 63; pw = 31; cp = 31 fig.15 control range of ew corner/parabola ratio. cp = 0, 31 and 63; ew = 31; pw = 63 fig.16 control range of ew trapezium correction. tc = 0, 31 and 63; ew = 31; pw = 31; cp = 0
december 1991 24 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 adjustment of geometry control parameters the deflection processor of the TDA9160 offers nine control parameters for picture alignment: s-correction, vertical amplitude, vertical slope and vertical shift for the vertical picture alignment horizontal shift, ew width, ew parabola/width, ew corner/parabola and ew trapezium correction for the horizontal picture alignment the required values for the settings of s-correction, ew parabola/width ratio and ew corner/parabola ratio are determined for a particular combination of picture tube type, vertical output stage and ew output stage. these parameters can be preset via the i 2 c-bus and do not require any additional adjustment. the remainder of the parameters are preset to the mid value of their control range (i.e. 1f), or to values that have obtained from previous tv set adjustments. after the vertical s-correction has been preset the vertical picture alignment could, in theory, be completed by positioning the top of the picture using the vertical amplitude adjustment and the bottom of the picture using the vertical slope adjustment (see note). it can be shown, however, that without compensation offsets in the external vertical output stage or in the picture tube would result in a certain linearity error especially with picture tubes that need large s-correction. the total linearity error is in first order approximation proportional to the offset and to the square of the required s-correction. a vertical shift control is available for offset compensation. for adjustment of the vertical shift, independent of the vertical slope, a special vertical shift alignment is provided. this mode is entered by setting the sbl bit high. in this mode the - (r-y) and - (b-y) outputs are blanked during the second half of the picture. the first line in which the colours are blanked must be positioned in the middle of the screen. the necessity to use the vertical shift alignment depends on the expected offsets in the vertical output stage and picture tube, on the required value of the s-correction and on the demands upon the vertical linearity. if the vertical shift alignment is not used vsh should be set to its mid value (i.e. vsh = 1f). the actual factory adjustments of the picture consist of the following steps: the vertical shift is adjusted as previously described (if required). the top of the picture is positioned by adjusting the vertical amplitude and the bottom of the picture by adjusting the vertical slope the picture is positioned in the horizontal direction by adjusting the ew width and horizontal shift the left and right hand sides of the picture are aligned in parallel by adjusting the ew trapezium correction (if required). note the value of the vertical slope determines the charge current of the vertical sawtooth capacitor (c saw as shown in fig.8) and thus the amplitude of the sawtooth voltage at pin 11. this voltage serves as the input voltage for the geometry processor. consequently the setting of the vertical slope will affect both the vertical and ew output currents.
december 1991 25 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 notes to figure 17 1. pins 31 and 32 are sensitive to leakage current. 2. the analog and digital ground currents should be well separated. 3. the decoupling capacitor connected between pins 8 and 9 must be placed as close to the ic as possible. fig.17 application diagram.
december 1991 26 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 package outline unit b 1 cee m h l references outline version european projection issue date iec jedec eiaj mm dimensions (mm are the original dimensions) sot232-1 92-11-17 95-02-04 b max. w m e e 1 1.3 0.8 0.53 0.40 0.32 0.23 29.4 28.5 9.1 8.7 3.2 2.8 0.18 1.778 10.16 10.7 10.2 12.2 10.5 1.6 4.7 0.51 3.8 m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 32 1 17 16 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. (1) (1) d (1) z a max. 12 a min. a max. sdip32: plastic shrink dual in-line package; 32 leads (400 mil) sot232-1
december 1991 27 philips semiconductors preliminary speci?cation pal/ntsc/secam decoder/sync processor TDA9160 soldering introduction there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mounted ics, or for printed-circuits with high population densities. in these situations reflow soldering is often used. this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our ic package databook (order code 9398 652 90011). soldering by dipping or by wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joint for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg max ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. repairing soldered joints apply a low voltage soldering iron (less than 24 v) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. purchase of philips i 2 c components data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation. purchase of philips i 2 c components conveys a license under the philips i 2 c patent to use the components in the i 2 c system provided the system conforms to the i 2 c specification defined by philips. this specification can be ordered using the code 9398 393 40011.


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